This thermally conductive 1-part epoxy adhesive is a heat-cured system with an unlimited working time. It is an off white, smooth, thixotropic paste that cures to form a hard, durable and thermally conductive polymer. It bonds well to a wide variety of substances.

Use this thermally conductive adhesive to glue heat sinks to LEDs, CPUs and other heat-generating components.

This 1-part thermal adhesive requires no mixing and is designed to simplify processing. It significantly reduces waste and increases productivity while relieving concerns regarding mix ratios, weighing, and working time. It is stable at room temperature and does not require frozen storage.

Image for illustrative purpose only

Features:
Thermal conductivity of 0.8 W/(m·K)
1-part – no mixing required
Room temperature storage
Unlimited working time
Cure time: 2 hour at 80 °C (176 °F) or 30 min at 120 °C (248 °F)
Provides strong electrical insulation
High compressive strength
Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons