This high thermal conductivity adhesive paste is a 2-part epoxy with a long 4-hour working time. It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates.

Use this thermal adhesive paste to glue heat sinks to LEDs, CPUs, and other heat-generating components. This product is highly viscous and must be mixed by hand prior to application. This adhesive has been formulated to have a long working time. .

Image for illustrative purpose only

Features:
Thermal conductivity of 1.4 W/(m·K)
1:1 mix ratio
Working time: 4 hours
Cure time: 1 hour at 80 °C (176 °F)
Provides strong electrical insulation
High tensile strength
Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons