The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.
Brand name (s) : MG Chemicals

Caution: Has the potential to cause severe skin burns and eye damage , liver damage through prolonged or repeated exposure. Do not handle, until all safety precautions have been read and understood.

Features:

• Excellent 1.36 W/(m•K) thermal conductivity
• Easy 1:1 mix ratio
• Adheres to most electronic substrates
• Stores and ships at slightly below room temperature — no freezing or dry ice required
• Very long shelf life of at least two years — even when stored at room temperature
• Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons