8327GL5 is a 1-part, silicone-free, high temperature, soft gel with very high thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the intricate geometries at the component/heatsink interface, ensuring all air is displaced and eliminating potential hotspots. It has a very low modulus and robust temperature range, making it a practical solution where high heat dissipation, low component stress and thermal cycling stability are needed. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience.

This thermal gel is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs.

This product’s consistency is flowable enough to dispense from a syringe yet will not run making it a truly form-in-place material. The low modulus gel can easily be compressed to achieve thin bond lines, minimizing thermal resistance.

For applications demanding less thermal conductivity, use 8327GL3 whereas 8327GL6 is suited for applications requiring maximum heat dissipation. We also have a full line of thermally conductive adhesives which provide a permanent bond and offer exceptional shock protection.

Features & Benefits:

• Thermal conductivity of 5.1 W/(m·K)
• Flame retardant—meets UL94 V-0
• High temperature stability
• 1-part, non-curable, dispensable gel
• Zero pump out—no slump under low pressure
• Silicone-free, will not contaminate surfaces
• Low modulus, ideal for aggressive thermal cycling conditions