8327GL3 is a 1-part silicone-free, ultra soft gel with high thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the intricate geometries at the component/heatsink interface, ensuring all air is displaced and eliminating potential hotspots. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience.

This thermal gel is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs.

This product is flowable enough to dispense from a syringe and will not run making it a form-in-place material. The low modulus gel can easily be compressed to achieve thin bond lines, minimizing thermal resistance.

For higher thermal conductivity, use 8327GL5 and 8327GL6 which have thermal conductivities of 5 and 6 W/(m·K) respectively. We also have a full line of thermally conductive adhesives which provide a permanent bond and offer exceptional shock protection.

Features & Benefits:

• Thermal conductivity of 3.5 W/(mK)
• Flame retardant—meets UL94 V-0
• 1-part, non-curable, dispensable gel
• Silicone-free, will not contaminate surfaces
• Low modulus, ideal for aggressive thermal cycling conditions