Made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no-clean flux. This lead-free and halogen-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

Applications:
4900P solder paste is designed to facilitate high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as to 0.3 mm.

Features:
Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
Flux meets J-STD-004B
Repeatable and consistent printing characteristics
Long stencil and tack life to facilitate high speed printing
Excellent wettability
Suitable for air or nitrogen atmospheres
Medium soft, non-cracking residues