Made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, non-conductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)
Applications and Uses

This solder paste is designed for use in high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

Features:
Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
Flux meets J-STD-004B
Non-corrosive
Non-conductive residue
Halide free
Good wettability
Type 3 (45-25 µm)